On November 30, Delong Laser, a laser fine micromachining equipment company, announced the completion of a new round of financing of several hundred million yuan. This round of financing was jointly invested by Woyan Capital Alliance and China Micro semiconductor, CLP Fund, Sunny V Fund and other institutions and enterprises.
The company’s early investment institution, Beijing Woyan Investment Center (Limited Partnership), holds 16.45% of the shares and is the second largest shareholder. Woyan Capital said that after this financing, it will help Delong Laser to lay a solid foundation for its deep cultivation in semiconductor, Display, consumer electronics and other fields.
As a manufacturer of etching equipment, China Micro is also an investor in this round of financing. China Microelectronics has capacitive plasma etching equipment, inductive plasma etching equipment and deep silicon etching equipment.
Suzhou Delong Laser Co., Ltd. (abbreviation: Delong Laser) was established in 2005, located in Suzhou Industrial Park, with investment from China and Australia. Specializing in the research and development, production and sales of precision laser processing equipment and lasers, the products are widely used in precision processing fields such as semiconductors, displays, precision electronics, scientific research and new energy.
The third-generation semiconductors such as silicon carbide and gallium nitride are hard and brittle materials. When using traditional mechanical cutting WaferSaw (wafer dicing), wafers made of these materials are prone to edge chipping and other defects, affecting The final yield and reliability of the product need to be replaced by a more advantageous processing method. The official website shows that the current Delong Laser’s silicon carbide wafer laser cutting equipment uses ultra-short pulse laser to ensure the high quality of silicon carbide wafers.